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Brand Name : | BJJCZ |
Payment Terms : | T/T |
Supply Ability : | 100000set |
Delivery Time : | 5-8 work days |
Introduction of 3W UV laser marking machine
3W UV laser marking machine is developed by using 355nm UV laser.
Compared with infrared laser, 355 UV laser focus spot is very
small. The marking effect is that the short wavelength laser
directly interrupts the molecular chain of materials, which greatly
reduces the mechanical deformation of materials. Although the
thermal deformation is cold light, it is mainly used for ultra-fine
marking It is especially suitable for food and medicine packaging
materials marking, microporous, glass, porcelain material
high-speed division and complex pattern cutting of silicon wafer.
Characteristics of 3W UV laser marking machine
1. Due to the small focusing spot and small heat affected zone, UV
laser can be used for ultra-fine marking, which is the first choice
for customers with higher requirements on marking effect;
2. In addition to copper, UV laser has more suitable materials for
processing;
3. Not only the beam quality is good, but also the focusing spot is
smaller, which can realize hyperfine labeling;
4. The application range is more extensive; the heat affected area
is very small, which will not produce thermal effect and material
burning problem;
5. It has the advantages of fast marking speed, high efficiency,
stable performance, small size and low power consumption;
Application of 3W UV laser marking machine
1. Suitable for glass (laser engraving machine for glassware), polymer materials and other objects surface marking, micro hole
processing;
2. It is widely used for marking the surface of packaging bottles
(boxes) of food, medicine, cosmetics, wires and other polymer
materials;
3. Flexible PCB, LCD, TFT marking, dicing and cutting, etc;
4. Removal of metallic or non-metallic coatings;
5. Micro hole and blind hole processing of silicon wafer;
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